ʻO ke ʻano polū kila kila

1.Mechanical polishing ʻO ka mīkini polishing kahi hana polishing e hoʻoneʻe i nā ʻāpana convex i poni ʻia ma o ka ʻoki ʻana a me ka deformation plastic o ka ʻili mea e loaʻa ai kahi ʻili laulima.ʻO ka mea maʻamau, hoʻohana ʻia nā ʻāpana ʻaila, nā huila huluhulu, ka pepa, a me nā mea ʻē aʻe. hoʻohana ʻia no nā koi o ka ʻili kiʻekiʻe.Ultra-precision wili a me ka polishing mea he kūikawā abrasive mea paahana, i kaomi ma luna o ka ili o ka workpiece e machined i loko o ka wili a me ka polishing wai i loaʻa abrasive, a rotates i kiʻekiʻe wikiwiki.Ke hoʻohana nei i kēia ʻenehana, hiki ke hoʻokō ʻia ka ʻili o Ra0.008μm, ʻo ia ka mea kiʻekiʻe loa ma waena o nā ʻano polishing like ʻole.Hoʻohana pinepine ʻia kēia ʻano hana i nā ʻano lens lens.
ʻIke ʻia nā huila hemp i kūʻai ʻia e ka ʻoihana no kēia ʻano polishing, ʻoi aku ka nui no ka polishing medium o ke kila kila.
2.Chemical polishing Chemical polishing mea e ae i na microscopically protruding 'āpana o ka mea i loko o ke kinikini mea e hoʻoheheʻe preferentially ma luna o ka concave'āpana, i laila e loaa i ka laumania ili.ʻO ka pōmaikaʻi nui o kēia ʻano hana, ʻaʻole ia e koi i nā mea hana paʻakikī, hiki ke hoʻopololei i nā mea hana me nā ʻano paʻakikī, a hiki ke hoʻoliʻi i nā mea hana he nui i ka manawa like, me ka hana kiʻekiʻe.ʻO ka pilikia nui o ka polishing kemikal ka hoʻomākaukau ʻana i ka wai polishing.ʻO ka ʻeleʻele o ka ʻili i loaʻa ma ka poli kemika he 10 μm.
3.Electrolytic polishing ʻO ke kumu kumu o ka polishing electrolytic ua like ia me ka polishing kemikal, ʻo ia hoʻi, ma ka hoʻoheheʻe koho ʻana i nā protrusions liʻiliʻi ma luna o ka ʻili o ka mea e hoʻomaʻamaʻa i ka ʻili.Ke hoʻohālikelike ʻia me ka polishing kemika, hiki ke hoʻopau ʻia ka hopena o ka hopena cathode, a ʻoi aku ka maikaʻi o ka hopena.Hoʻokaʻawale ʻia ke kaʻina hana polishing electrochemical i ʻelua mau ʻanuʻu: (1) Macroscopically flattening i nā huahana i hoʻoheheʻe ʻia a hoʻopuehu i loko o ka electrolyte, ke emi nei ka geometrical roughness o ka ʻili o ka mea, a me Ra> 1μm.(2) Hoʻopili ʻia ka polarization anodic e ke kukui haʻahaʻa, a hoʻomaikaʻi ʻia ka ʻōlinolino o ka ʻili, a ʻo Ra.<1μm.<br /> 4. I ka ultrasonic polishing, ua kau ka mea hana i loko o ka abrasive suspension a waiho i loko o ke kani ultrasonic kahua hui, a me ka abrasive i lepo a poni ia ma luna o ka ili o ka workpiece e ka oscillation o ka ultrasonic nä hawewe.He liʻiliʻi ka ikaika macroscopic o ka hana kani ultrasonic, a ʻaʻole ia e hoʻololi i ka mea hana, akā paʻakikī ke hana a hoʻokomo i ka mea hana.Hiki ke hoʻohui ʻia ka mīkini kani kani me nā ʻano kemika a i ʻole electrochemical.Ma ke kumu o ka corrosion solution a me ka electrolysis, hoʻohana ʻia ka haʻalulu kani ultrasonic e hoʻoulu i ka hopena, i hoʻokaʻawale ʻia nā huahana i hoʻoheheʻe ʻia ma ka ʻili o ka mea hana, a ʻo ka corrosion a i ʻole electrolyte kokoke i ka ʻili he ʻano like;ʻO ka cavitation o nā hawewe kani ultrasonic i loko o ka wai hiki ke kāohi i ke kaʻina hana corrosion, kahi kūpono i ka hoʻomālamalama ʻana o ka ʻili.
5.Fluid polishing Ke hilinaʻi nei ka wai polishing i ka wai kahe kahe kiʻekiʻe a me nā ʻāpana abrasive i lawe ʻia e ia e ʻoki i ka ʻili o ka mea hana e hoʻokō ai i ke kumu o ka polishing.ʻO nā ʻano hana maʻamau: ka mīkini jet abrasive, ka mīkini jet wai, hydrodynamic grinding, etc. ʻO ka hydrodynamic grinding ke alakaʻi ʻia e ke kaomi hydraulic, no laila e kahe ka wai e lawe ana i nā ʻāpana abrasive ma luna o ka ʻili o ka mea hana i ka wikiwiki kiʻekiʻe.ʻO ka mea waena i hana nui ʻia i nā pūhui kūikawā (polymer-like substance) me ka flowability maikaʻi ma lalo o ke kaomi haʻahaʻa a hui pū ʻia me nā abrasives, a hiki i nā abrasives ke silicon carbide pauka.
6. ʻO ka wili a me ka polishing ʻO ka magnetic grinding a me ka polishing ka hoʻohana ʻana i nā abrasives magnetic e hana ai i nā pulupulu abrasive ma lalo o ka hana a kahi māla magnetic e wili i nā mea hana.Loaʻa i kēia ʻano ka hana kiʻekiʻe o ka hana, ka maikaʻi maikaʻi, ka mana maʻalahi o nā kūlana hana a me nā kūlana hana maikaʻi.Me nā abrasives kūpono, hiki i ka roughness ili ke hiki i Ra0.1μm.